Semiconductor Packaging News
WEBSemiconductor Engineering. ASML needs license for some services in China. The Dutch government now requires ASML Holding NV to obtain licenses for servicing chipmaking equipment sold to China, including spare parts and software. New restrictions begin on Sept. 6, expanding to ASML’s 1980di and 1970di machines.
Semiconductor Packaging News
WEBResearch Bits: Aug. 27. Nagoya Univ. researchers have developed a more eco-friendly and cost-effective method to grow gallium nitride semiconductors without ammonia. Their radical-enhanced metalorganic chemical vapor deposition technique reduces temps, uses less toxic gases & speeds up the process. Semiconductor Engineering.
Semiconductor Packaging News
WEBBroadcom says it will sell $12 billion in AI parts and custom chips this year. Broadcom exceeded Wall Street's third-quarter expectations for revenue and earnings, but a $1.88 billion net loss from a tax provision led to a 7% drop in shares. Despite strong AI and semiconductor sales, revenue guidance met expectations at $14 billion.
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WEBNews Index. 23701 news listings. To search a phrase, place it in quotes. Japanese semiconductor equipment giants Tokyo Electron and Screen Holdings have seen significant revenue growth from China, with over 50% of ... India and Singapore's recent agreements bolster India's semiconductor ecosystem, with new investments from Kaynes Semicon and ...
Semiconductor Packaging News
WEBTSMC sales rise on AI demand. Taiwan Semiconductor Manufacturing Co (TSMC) reported a 33% revenue rise year-on-year in August, reaching NT$250.87 billion. This growth, fueled by demand for Nvidia’s AI chips and smartphones, positions TSMC to exceed third-quarter revenue projections by 5-6%. Taipei Times.
2024 State of the Industry Report Underscores Opportunities and ...
WEB1 day ago · The Semiconductor Industry Association's annual report highlights record global sales of $527 billion and forecasts $600 billion in 2024. With growing demand, U.S. chip production is set to triple, thanks to investments spurred by the CHIPS Act, despite workforce and policy challenges ...
Will 2024 be the Year of Advanced Packaging?
WEBWill 2024 be the Year of Advanced Packaging? IDTechEx's report highlights how advanced packaging technologies like 2.5D & 3D are boosting semiconductor innovation. These methods improve chiplet integration & system performance, paving the way for breakthroughs in AI, 5G & data centers despite material & cost challenges.
Advanced Packaging Drives New Memory Solutions for the AI Era
WEB9 hours ago · Summary. Artificial intelligence (AI) is driving demand for more computing power and advanced memory technologies like High-Bandwidth Memory (HBM). HBM, with its stacked DRAM architecture, provides high-speed data transfer and efficiency. Lam Research leads in developing advanced packaging solutions that enhance HBM's performance, collaborating ...
Intel's strategic transition: can new orders and cost cuts lead to a ...
WEB1 day ago · Intel faces challenges as it cuts 15,000 jobs and reduces real estate, aiming to slash costs by $10 billion. Despite its legacy as a top U.S. company, Intel's future depends on new orders and cost-saving efforts to regain momentum. The dedicated team at Semiconductor Packaging News has provided this summary for your convenience.
CHIPS Subsidy Boosts Advanced Packaging in U.S.
WEBA $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. Department of Commerce launches a competition to spur R&D in energy-efficient tech. The dedicated team at Semiconductor Packaging News has provided this …
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