Georgia Tech has joined Apple's initiative aimed at preparing students for hardware technology, computer architecture and chip design.
Renesas introduces new AnalogPAK ICs which optimise component efficiency for diverse Consumer electronics applications.
The expanding need for high-performance computing and data transmission is a central driver for the Photonic Integrated ...
Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, which are more complex than in 2D IC designs. New materials used in 3D ICs ...
MACOM Technology Solutions has bought ENGIN-IC, a fabless semiconductor company based in Texas. The Lowell, ...
Focused on the defense industry, Plano-based ENGIN-IC is a fabless semiconductor company that designs advanced Gallium ...
Founded in 2014 by industry veterans, ENGIN-IC has focused on serving the U.S. defense industry since its inception. The company was self-funded and utilized small business innovative research (SBIR) ...
In-house flows are unable to keep up with foundry PDKs and heterogeneous integration, but commercial EDA tools add their own set of challenges.
Integrated Circuits (ICs) and System-on-Chip (SoC) designs are the cornerstones of modern electronics, driving the ...
Taiwanese giant Foxconn's subsidiary Shunsin is seeking a permit to invest $80 million in northern Vietnam to produce ...
HANOI, Nov 4 (Reuters) - Taiwanese giant Foxconn's subsidiary Shunsin <6451.TW> is seeking a permit to invest $80 million in ...